Details

Subject(s)

• Manufacturing processes—Mathematical models—Congresses [Browse]
• Manufacturing processes—Automatic control—Congresses [Browse]
• Intelligent control systems—Mathematical models—Congresses [Browse]
• Process control—Mathematical models—Congresses [Browse]

Related name

• Tobin, Kenneth W. [Browse]
• Society of Photo-optical Instrumentation Engineers [Browse]
• Semiconductor Equipment and Materials International [Browse]
• International SEMATECH [Browse]

Series

• Proceedings of SPIE--the International Society for Optical Engineering ; v. 5378. [More in this series]
• SPIE proceedings series, 0277-786X ; v. 5378

Bibliographic references

Includes bibliographical references and index.

Contents

• Intel nanotechnology integrated process control systems : an overview (keynote address) / K. Srinivasan and Y. Botros
• In-tool process control for advanced patterning based on integrated metrology / D. S. L. Mui, H. Sasano, W. Liu, J. Yamartino and A. Skumanich
• Multivariable versus univariable APC / K. Faron, M. Freeland, O. Krogh, S. Patel and G. Raghavendria
• Advanced process control applied to metal overlay proces / C. J. Gould, Y. Cui and S. Louks
• Modeling for profile-based process-window metrology / C. P. Ausschnitt and S. Y. Cheng
• Model-based fault detection and metrology error rejection in registration APC system / Z. J. Mo and I. Geier
• Simulation benchmarking for the whole resist process / S. -K. Kim, J. -E. Lee, S. -W. Park, J. -Y. Yoo and H. -K. Oh
• Advanced module-based approach to effective CD predition of sub-100nm patterns / J. Shin, I. Kim, C. Hwang, D. -W. Park, S. -G. Woo, H. -K. Cho, W. -S. Han and J. -T. Moon
• Propagation of APC models across product boundaries / T. Chowdhury, M. Freeland, O. Krogh, G. Narasimhan and G. Raghavendra
• Comparing the transient response of a resistive-type sensor with a thin film thermocouple during the post-exposure bake process / K. G. Kreider, D. P. DeWitt, J. B. Fowler, J. E. Proctor, W. A. Kimes, D. C. Ripple and B. K. Tsai
• Intra-water CDU characterization to determine process and focus contributions based on scatterometry metrology / M. Dusa, R. Moerman, B. Singh, P. Friedberg, R. Hoobler and T. Zavecs
• In-fine lithography cluster monitoring and control using inetgrated scatterometry / I. Pollentier, S. Y. Cheng, B. Baudemprez, D. Laidler, Y. van Dommelen, R. Carpaij, J. Yu, J. Uchida, A. Viswanathan, D. Chin, K. Barry and N. Jakatdor
• Complementary feed-forward and feedback method for improved critical dimension control / L. Jekauc, C. Gould, W. Hartner and T. Urenda
• Automatic defect classification using topography map from SEM photometric stereo / S. D. Serulnik, J. Cohen, B. Sherman and A. Ben-Porath
• Automated fault detection and classification of etch systems using modular neural networks / S. J. Hong, G. S. May, J. Yamartino and A. Skumanich
• Integrated electrical and SEM-based defect characterization for rapid yield ramp / J. Orbon, L. Levin, O. Bokobzo, R. Shimshi, M. Dutta, B. Zhang, D. Ciplickas, T. Pham and J. Jansen
• PVD fault detection using disparate integrated data sources / A. F. Krauss
• CD error budget analysis in Arf lithography / T. Otsuka and K. Sakamoto
• Improvement of 90nm KrF Cu process window by minimizing via deformation caused by low-frequency resonance of scanner projection lens / S.-P. Fang, B. S.-M. Lin and K.-C. Hung
• Use case approach to integrating and implementing lithography run-to-run control / D. Karlikar, I. K. Abramovich, M. Kish, D. Crow, E. Joubert and A. Carlson
• Enhancement of photolithographic performance by implementing an advanced process control system / D. Crow, E. Joubert, A. Carlson, I. K. Abramovich, D. Karlikar and M. Kish
• Yield loss in lithographic patterning at the 65nm node and beyond / K. M. Manahan, B. Eichelberger, M. Hankinson, J. Robinson and M. Slessor
• Improving manufacturing variability control in advanced CMOS technology by using TCAD methodology / J. Chen, J. Wu, K. Liu, H. Yang and D. Scott
• Mix-and-match overlay method by compensating dynamic scan distortion error / T. Kono, M. Takakuwa, K. Asanuma, N. Komine and T. Higashiki
• Necessary nonzero lithography overlay correctables for improved device performance for 110nm generation and lower geometries / I. Jekauc, B. Roberts, P. Young, P. Jowell, R. Ferguson and S. Louks
• Development of customer assistance software for alignment parameter optimization / Y. Kanaya and S. Nakajima.

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ISBN

0819452912

OCLC

55482782

RCP

C - S

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