Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado / sponsored by ISHM--the Microelectronics Society ... [et al.] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits.

Format
Book
Language
English
Published/​Created
Reston, Va. : ISHM ; Wheaton, Ill. : International Electronics Packaging Society ; [Belingham, Wash.] : Published in cooperation with SPIE--the International Society for Optical Engineering, c1994.
Description
x, 630 p. : ill. ; 28 cm.

Details

Subject(s)
Related name
Series
  • Proceedings of SPIE--the International Society for Optical Engineering ; v. 2256. [More in this series]
  • SPIE proceedings series ; v. 2256
Notes
  • "Third International Conference and Exhibition on Multichip Modules"--P. iii.
  • Spine title: 1994 proceedings International Conference and Exhibition on Multichip Modules.
Bibliographic references
Includes bibliographical references and index.
Other title(s)
1994 proceedings International Conference and Exhibition on Multichip Modules.
ISBN
0930815394 (pbk.)
OCLC
31859876
Statement on language in description
Princeton University Library aims to describe library materials in a manner that is respectful to the individuals and communities who create, use, and are represented in the collections we manage. Read more...
Other views
Staff view