ASME 2009 InterPACK Conference. Volume 2, Modeling and simulation ; Thermal management : component level thermal management ; Thermal management : system level thermal management [electronic resource].

Author
ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.) [Browse]
Format
Book
Language
English
Published/​Created
[New York] : ASME, c2009.
Description
1 online resource (1086 p.)

Details

Subject(s)
Source of description
Description based on online resource; title from title screen (ASME, viewed August 28, 2013).
Other title(s)
American Society of Mechanical Engineers 2009 InterPACK Conference
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