2019 IEEE/ACM International Conference on Technical Debt (TechDebt) / Institute of Electrical and Electronics Engineers.

Author
Institute of Electrical and Electronics Engineers [Browse]
Format
Book
Language
English
Published/​Created
  • Piscataway, NJ : IEEE, 2019.
  • ©2019
Description
1 online resource (32 pages) : illustrations

Availability

Details

Subject(s)
Bibliographic references
Includes bibliographical references and index.
Source of description
Description based on publisher supplied metadata and other sources.
Other title(s)
2019 IEEE/ACM International Conference on Technical Debt
ISBN
1-7281-3371-8
Statement on language in description
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