Details

Subject(s)

• Hybrid integrated circuits—Design and construction [Browse]
• Hybrid integrated circuits—Power supply [Browse]

Series

• Electrical and computer engineering series. [More in this series]
• Electrical engineering and electronics Power hybrid circuit design and manufacture

Summary note

"Discusses the fundamental design principles, capabilities, and applications of power hybrid microcircuits and modules--detailing the operation of power semiconductor and passive components, the properties of materials, design guidelines, thermal management, and manufacturing technologies.".

Notes

Bibliographic Level Mode of Issuance: Monograph

Bibliographic references

Includes bibliographical references and index.

Source of description

Description based on print version record.

Language note

English

Contents

• chapter 1 HYBRID MICROCIRCUIT TECHNOLOGY
• chapter 1 2 ELECTRONIC PACKAGING TECHNIQUES
• Packaging is often cited as one of the most performance limiting aspects of advanced power semiconductors. Power hybrids overcome the limitations of conventional packaging and interconnection schemes and extend the operating range of semiconductor devices. At the same time, the use of power hybrids allows the designer to optimize performance by combining discrete devices from
• chapter 2 COMPONENTS PARTS
• chapter firedin fired
• furnace at temperatures near 1000°C. typical furnace profile is shown in Figure Electrical performance of thick-film resistor is strongly influenced by the firing process. When the screened resistor paste pattern passes through the nace, the mixture of glass binder and conductive phase particles undergo sinter- resistor film. The main parameters of the firing profile: temperature rise and descent rates, peak firing temperature and process duration, vary from paste to paste and depend upon the manufacturing technol- resistor film non-homogeneous and particles appear in random distribution. It
• chapter 2 2.2.5 Solid Tantalum Capacitors
• chapter 2 3.1.1 Fast Recovery Rectifiers
• chapter 2 3.4 Integrated Circuit (IC)
• chapter 1 (****) (*)(**)(***) (****)
• chapter 3 MATERIALS
• chapter Chapter
• chapter 3 4 ADHESIVES
• chapter indium
• chapter 4 POWER HYBRID DESIGN
• chapter POWER HYBRID CIRCUIT
• chapter Paper Design: |-*| Prototype: Evaluation:
• chapter 4 3. 4 Layout Desig n
• There is a considerable overlap in guidelines for design of low power and high power hybrids plexity circuits are partitioned into the low power and high power sections, which lines which are not intended to be all inclusive. They are primarily aimed at spe-
• chapter laser
• chapter large 1-bonding
• diameter aluminum wire: tool, 2-transducer, 3-wire clamps, 4-aluminum wire, 5-wire
• chapter 4 3.5 Detail Documentation
• chapter 4 3.5.2 Artwor k Drawings 3.5.3 Substrate Drawings
• ductor and glass patterns are transferred to a magnetic media, which is used to produce an artwork master in a 1:1 scale on a stable photographic film. The pat- terns for each separate screening operation are individually exposed using pho- toplotting equipment.
• chapter Figure 5-10 Normalized effective transient thermal impedance vs. square wave pulse duration.
• chapter flowoverlaps.
• chapter 5 5 THERMAL MEASUREMENTS
• Calculations of the thermal resistance and reliability predictions provide theoreti- ditions, which can'
• chapter 6 MANUFACTURING
• chapter 7 APPLICATIONS
• chapter APPENDIX A: GLOSSARY OF HYBRID MICROCIRCUITS PACKAGING TERMS
• chapter A and of
• chapter die in and
• chapter or and
• chapter to a
• chapter for of as in
• chapter 1 or of to of as a a
• chapter is IR is in The a the
• chapter 2 or is by the cut
• chapter on a
• chapter in and of
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• chapter APPENDIX B: UNIT CONVERSION TABLES
• chapter Table B-14: Temperature conversion °c °F °c °F °c °F °C õ
• Ref. Ref. Ref. Ref. °F 1
• chapter °F °c °F °C.

Show 45 more Contents items

ISBN

• 1-4822-9216-5
• 1-315-21444-X
• 0-585-26869-X

OCLC

45728934

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