Details

Subject(s)

• Printed circuits industry—Waste minimization—Case studies [Browse]
• Printed circuits industry—Waste minimization—Evaluation [Browse]
• Semiconductor industry—Waste minimization—Case studies [Browse]
• Semiconductor industry—Waste minimization—Evaluation [Browse]

Related name

• Nunno, T. [Browse]

Series

• Pollution technology review ; no. 162. [More in this series]
• Pollution technology review, 0090-516X ; no. 162 [More in this series]

Summary note

Contains case studies conducted at six facilities to evaluate the technical, environmental and cost impacts associated with the implementation of technologies for reducing the volume and toxicity of printed circuit board metals-containing sludges and solvent wastes. Analyses of these data are the basis for demonstrating technologies to reduce hazardous waste. The information is from the book of this title published by the EPA in Jan. 1988. No index. Annotation copyrighted by Book News, Inc., Portland, OR

Bibliographic references

Includes bibliographical references (p. 149-151).

Source of description

Description based upon print version of record.

Language note

English

Contents

• Front Cover; Toxic Waste Minimization in the Printed Circuit Board Industry; Copyright Page; Foreword; ACKNOWLEDGMENTS; NOTICE; Table of Contents; CHAPTER 1. INTRODUCTION AND SUMMARY; Background; Waste Minimization Case Study Selection; Project Summary and Results; CHAPTER 2. CONCLUSIONS; Electronic Industry Waste Management; Case Study Findings; CHAPTER 3. RECOMMENDATIONS; CHAPTER 4. THE ELECTRONICS PRODUCTS INDUSTRY; Background; Waste Generation; Waste Management; CHAPTER 5. FACILITY A CASE STUDY; Facility Characterization; Process Testing and Analytical Results; Economic Evaluation
• CHAPTER 6. FACILITY B CASE STUDY; Facility Characterization; Process Testing and Analytical Results; Economic and Environmental Evaluation; CHAPTER 7. FACILITY C CASE STUDY; Facility Characteristics; Process Testing and Analytical Results; Economic and Environmental Evaluation; CHAPTER 8. FACILITY D CASE STUDY; Facility Characterization; Process Testing and Analytical Results; Economic and Environmental Evaluation; CHAPTER 9. FACILITY E CASE STUDY; Facility Characterization; Process Testing and Analytical Results; Economic and Environmental Evaluation; CHAPTER 10. FACILITY F CASE STUDY
• Facility Characterization; Process Testing and Analytical Results; Economic and Environmental Evaluation; APPENDIX A: QUALITY ASSURANCE SUMMARY; Introduction; Project Organization and Responsibility; Precision, Accuracy, Completeness, Representativeness and Comparability; Sampling Procedures; Sample Custody; Calibration Procedures and Frequency; Analytical Procedures; Data Reduction, Validation, and Reporting; Internal Quality Control Checks; Preventive Maintenance; Assessment of Precision, Accuracy and Completeness; Corrective Action; Quality Assurance Reports; HANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS

ISBN

• 1-283-44798-3
• 9786613447982
• 0-8155-2001-8
• 1-59124-165-0

OCLC

850177919

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